SiC/Al, B₄C/Al, Diamond/Al and other composite materials

Silicon-aluminum alloy can replace Kovar alloy, copper alloy, etc. in electronic packaging products. It not only has low cost but also has the following advantages: (1) The main components are silicon and aluminum, which do not contain strategic meta...

Product advantages: Aluminum matrix composite products combine the good thermal conductivity, processability, plastic toughness, weldability, electrical conductivity, low density of aluminum alloys with the low expansion, high stiffness, high hardnes...

Main products: 6061, AISi40, AICu series, etc. Cooling rate: 100-100000K/s. Product features The slow cooling rate of ordinary aluminum alloys will bring about coarse internal dendrites, thermal stress imbalance, and uneven surface. Microcrystallin...

Performance advantages: (1) High purity: W (impurity content) ≤ 0.15% (2) Low oxygen content: ≤300pm (3) High sphericity: ≥97% (4) Adjustable particle size: 15-53µm; 20-63µm, etc. (5) High fluidity: angle of repose 30±5° (6) Good density: bulk densit...

Product processing performance: 1. General tolerance: CNC: normal +/-0.05mm Wire EDM: Normal +/-0.02mm 2. Flatness: Normally 1/1000, up to 1/10000 3. Surface finish: normal Ra after milling <1µ; normal Ra after grinding = 0.4µ; after polishing, it c...